乐泰EN UF3811 ,ECCOBOND EN 3810

乐泰UF3810,乐泰UF3811原装供应,汉高乐泰胶水\昆山\上海\吴江\广州\佛山代理销售处：137\51\13\63\32.陈生 Q.Q/30/22/24/564/ 网.址。w.w.w.a.a.l.o.c.t.i.t.e.c.o.m. ECCOBOND EN 3810T ECCOBOND EN 3838T LOCTITE ECCOBOND EN 3810T and LOCTITE? ECCOBOND EN 3838T are primarily designed for encapsulating ponents on a printed circuit board (PCB). When cured, these materials provide stable electronic performance in temperature/ humidity/bias testing. Both materials are designed to be jet dispensible, and their thixotropic nature allows for improved flow control and targetedLOCTITE ECCOBOND UF 3811 3838T LOCTITE ECCOBOND UF 3811 is a reworkable epoxy underfill designed for Chip-Scale Package (CSP) and Ball Grid Array (BGA) applications. This low-viscosity material is formulated to flow at room temperature with no additional preheating required